De-Bonder Tool
Tool Configuration
- Integration with EFEM. Four load ports and two thermal slide debonding stations.
- Equipped with robot / aligner.
- Equipped with one set of cleaner.
- Optional wafer pickup based on customer requirements.
- Equipped with SECS / GEM for automation.
- It can be combined with a bonder as a combo machine.
- Suitable for debonding applications in GaAs, GaN, LED, and 3DIC processes.