Descum / Plasma Polish Tool
Application Scope
- Descum: Removing residues from photoresist (PR) or polyimide (PI) after development.
- Removal of laser released layers.
- Dry etching of ABF.
- Plasma polishing to remove damage layers on SiC chips after grinding.
Tool Configuration
- It can be configured with EFEM (Equipment Front End Module) to directly dock two chambers, minimizing cleanroom space requirements and maximizing efficiency.
- It can be combined with other applications using a single transfer chamber, accommodating up to six chambers for different purposes.
- Highly customizable chamber configurations based on customer requirements.
- Equipped with SECS / GEM for automation.