• Each ALD system is equipped with six chamber positions and is highly integrated with EFEM.
• Highly customizable chamber configurations based on customer requirements.
• Optional treatment chamber for effective pre-treatment or post-treatment of ALD depositions.
• Depending on temperature and plasma damage concerns, you can choose between Thermal-ALD or PE-ALD.
• Equipped with SECS / GEM for automation.
• Patented gas inlet design and showerhead system for excellent uniformity.
• Optional automatic pick and place tool to enable coating of different wafer sizes on a 12-inch platform, to support fab automation.