Physical Vapor Deposition (PVD) technology is crucial in all semiconductor processes (front-end, back-end, compound semiconductors, and optoelectronic industries). There is currently no foreseeable replacement for this technology in the near future. Atomic Layer Deposition (ALD) represents the next generation of semiconductor processing technology. As linewidths become increasingly finer and the demand for higher-quality thin films rises, ALD becomes a critical solution. In the future, wafer bonding and debonding technologies, also known as Bonder and De-Bonder, will become increasingly essential due to the requirements for better heat dissipation and reduced impedance. As wafers need to be thinned further, these technologies aim to provide sufficient mechanical strength to the thinned chips. They must not only overcome the challenges associated with wafer thinning but also meet the stringent demands for post-thinning process temperatures and stress. As semiconductor processes advance, the demand for these technologies continues to grow.
In 2017, Skytech made a determined commitment to root itself in the development of advanced semiconductor equipment under its own brand. The following year, we designed our first set of semiconductor wafer manufacturing equipment, the PVD machine - Nexda! In the same year, it also simultaneously developed bonders and de-bonders of various sizes and de-bonding machines.