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機台設備

Special EFEM design for IGBT thin wafer (<100um), 60um Taiko wafer and +/- 5mm warpage wafer handling. Expand>>
Patented precursor inlet and showerhead system design to achieve excellent uniformity.
Patented chamber gas-wall design for particle reduction and PM lifetime prolong which shows much better performance than batch type ALD tool. Expand>>
4~6 inches temporary bonding tool for GaN/LED wafer thinning application.
Patented wafer and carrier alignment system design which could achieve excellent (<50um) alignment performance. Expand>>
Auto and Semi-auto 4~6 inches de-bonder for GaN/LED application.
Patented tool design for stable de-bonding process with high productivity and thin wafer (>50um) handling. Expand>>
Integrated main system with 4”/6” cassette & on-site retrofittable
By Bernoulli chucking robotic arms, wafers are conveyed without being touched.
High efficiency Ethernet communication
Support SECS/GEM. Better automation support with less operation loading. Expand>>
Welded bellow/ Formed bellow.
High density and purity ceramic products.
High density and purity quartz products.
High quality metal products.
Engineering plastics products. Expand>>

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Overview

Products & Service

Contact Us

Head Quarter
6F., No.1, Jiazheng 1st St., Zhubei City, Hsinchu County 30272, Taiwan
TEL: +886-3-6673055 FAX: +886-3-6673056

Manufacturing Site and Office
No.1, Ren-ai Rd., Hukou Industrial Park, Hsinchu County 30352, Taiwan TEL: +886-3-6673055 FAX: +886-3-6673056