De-bonder製程設備

Catapulta™ Portfolios

Semi-Auto Catapulta™

Semi-Auto 4 & 6” de-bonder

De-Bonder station x3

Manually put bonded wafer on de-bonder stage and recipe control de-bond process

Auto Catapulta™

Auto 4 & 6” de-bonder

Integrated with EFEM

Support SECS/GEM

De-bonder station x2

Cleaner station x2

Robot /Aligner x1

Loadport x4

半自動 Catapulta™ 150s 機台配置:

半自動 4” & 6” 解鍵合機

解鍵合站 x 3

手動將鍵合晶圓置於解鍵合站和recipe控制解鍵合工藝

最高製程溫度: 200°C

Recipe控制4吋和6吋晶圓工藝切換, 無需任何H/W變化。

Tool configuration of Semi-Auto Catapulta™

De-bonder Station x3

Max. process temp : 250°C

Recipe controlled 4 & 6 inches wafer process switch, without any H/W change.

Tool configuration of Auto Catapulta™

Integrated with EFEM

Support SECS/GEM

Robot /Aligner x1

Loadport x4

De-bonder Station x2

Cleaner x2

Catapulta™ Module

自動機與半自動機的比較