Bonder製程設備

Bondela™ Products Portfolios

Bondela™ WBDB Combo

New multiple wafer size bonder that capable for 2”, 3”, 4”, 6”, 8” bonding for GaAs, GaN, LED, 3DIC applications.

Adjustable bonding force with bonding force sensor (Max. bonding force : 10kN)

Up and bottom bonding head with heating capability and temp could up to 300°C

Novel bonding method for bobble free bonding performance

Manual de-bond module could be the optional item.

Bondela™ Semi-Bonder

Auto Bonder : Bondela™

Tool configuration

Integrated with EFEM

Support SECS/GEM

Robot /Aligner x1

Loadport x3

Coater x1 (w/ EBR function)

Pre-bake x1 (3 stacked)

Bonder Station x2

Bondela™ 100/150 Module

Novel Alignment Pin Design

Novel and High Accuracy Alignment Pin Design

Novel cam structure design for wafer & sapphire alignment.

±50um device wafer/carrier center shift.

Skytech Bonder Performance

Novel, multiple bonding size and high accuracy alignment pin design to achieve

Achieved < 10um alignment performance, and void free performance under 150mm wafer bonded on 159mm sapphire condition.

150/159 Bonding Performance

Achieved void free performance under novel bonding design (tilted put sapphire on wafer).

Even under very low bonding (<50N) still could achieve void free bonding performance.



150/150 Bonding Results

Novel, multiple bonding size and high accuracy alignment pin design to achieve

Achieved < 10 um alignment performance (almost hard to judge the bonding shift), and void free performance under 150mm wafer bonded on 150mm sapphire condition.

150/150 Notch to Notch Bonding

Good notch to notch alignment performance, <50um center shift (in-house OM check), and void free performance under 150mm wafer bonded on 150mm sapphire condition.

100/159 Bonding Results

Novel, multiple bonding size and high accuracy alignment pin design to achieve

Achieved 100mm wafer to 159 Sapphire bonding