Max. 6 ALD
Integrated with EFEM
專利氣牆設計以減少particle，PM lifetime比batch type的優良。
搭配Skiwar (自動取放片機) 以減少particle。
ALD AC box & Gas Box :
The design of the refrigeration chip allows the temperature control of the TMA to be maintained at a temperature of ± 1°C.
Film thickness validation were checked by TEM, FIB and SEM that showed quite linear and stable process on Atomila ALD system.
TEM pictures show the Al2O3 films are dense and amorphous
Stable reflective index vs process temp
Stable reflective index vs thickness, and the n values are fitting to Barbos et al’s model.
Average thickness stability and average non-uniformity within 12” wafer is excellent.